JPH0134430Y2 - - Google Patents
Info
- Publication number
- JPH0134430Y2 JPH0134430Y2 JP18266482U JP18266482U JPH0134430Y2 JP H0134430 Y2 JPH0134430 Y2 JP H0134430Y2 JP 18266482 U JP18266482 U JP 18266482U JP 18266482 U JP18266482 U JP 18266482U JP H0134430 Y2 JPH0134430 Y2 JP H0134430Y2
- Authority
- JP
- Japan
- Prior art keywords
- fixed contact
- contact
- contacts
- delay line
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 22
- 230000007797 corrosion Effects 0.000 claims description 10
- 238000005260 corrosion Methods 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 31
- 238000007747 plating Methods 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 229910052759 nickel Inorganic materials 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Filters And Equalizers (AREA)
- Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18266482U JPS5986724U (ja) | 1982-12-02 | 1982-12-02 | 可変遅延線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18266482U JPS5986724U (ja) | 1982-12-02 | 1982-12-02 | 可変遅延線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5986724U JPS5986724U (ja) | 1984-06-12 |
| JPH0134430Y2 true JPH0134430Y2 (en]) | 1989-10-19 |
Family
ID=30395522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18266482U Granted JPS5986724U (ja) | 1982-12-02 | 1982-12-02 | 可変遅延線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5986724U (en]) |
-
1982
- 1982-12-02 JP JP18266482U patent/JPS5986724U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5986724U (ja) | 1984-06-12 |
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